From design to full manufacturing, we develop your electronic systems and testing solutions, in small and medium series, with agility and precision.
SEF Power manufactures complete electronic systems, both for its own products and for third parties as a subcontractor, from prototype to series production.
Our specialties: SMT-BGA-QFN and traditional wiring, harness assembly, wire wrapping, conformal coating, potting, enclosure integration, and functional testing.
Our modern equipment includes:
- A DEK NeoHorizon 03iX screen printer
- A Mycronic MY300DX-13 Pick & Place machine with a throughput of 40,000 components/hour
- A 5-zone double reflow oven and an Asscon vapor phase system
- An Omron VT S730 3D AOI system
- A RoHS solder wave and a leaded solder wave
- An Ersa 550 BGA rework station
- An oven reaching 300°C and a climatic chamber (range from -30°C to 80°C)
A climatic chamber regulates temperature and humidity to within 1% in order to ensure optimal storage conditions for critical MSL components.
The DEK NeoHorizon 03iX screen printer ensures precise and consistent paste deposition on the PCB pads.
The accuracy of the MY300 pick-and-place heads and its 4K camera enables the placement of 01005, BGA, and QFP components.
Visual inspection is fully automated thanks to the three cameras of the Omron VT S730 3D AOI, which can verify in record time that each component is perfectly placed and soldered onto the PCB.
SEF Power is the ideal partner in Île-de-France for your rapid prototyping needs and series production up to 10,000 units.
The skills of our team and the flexibility of our structure allow us to respond to your requirements very quickly.
Our design office and test engineers can also support you in the development of test benches to ensure perfect operation before shipment of complete systems.
SMT Assembly
SMT assembly requires modern processes such as screen printing, automated component placement, and reflow soldering. These steps ensure high precision and optimal reliability. Rigorous quality control at each stage guarantees that electronic assemblies comply with current standards.
Wired Assembly
Wired assembly allows interconnection of PCBs and electronic components. It requires precision, rigor, and genuine technical expertise to ensure reliable and durable connections. Each harness must be carefully prepared, positioned, and inspected to meet the requirements of the final product.
Complete Assembly and Integration
Working in partnership, we act as your trusted factory and can deliver a complete solution by integrating all components of a finished product. From sourcing to assembly, we handle every step to provide you with a turnkey service that is reliable and responsive.
3D AOI Optical Inspection, Functional & Thermal Testing
Thanks to our 3D AOI system, each printed circuit board is automatically inspected.
Functional tests on test benches and thermal endurance tests allow verification of all technical performance aspects.
- SMT and traditional assembly
- Wired assembly (crimping, soldering, wire wrapping)
- Mechanical integration
- Functional and electrical safety testing on automated test benches
- Burn-in and climatic testing